| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 8037175 | Thin Solid Films | 2013 | 9 Pages |
Abstract
⺠Bonding quality degraded with decreasing Al thickness. ⺠Apparent friction coefficient was dependent on Al thickness. ⺠Longitudinal distance to the breaking point increased with increasing Al thickness. ⺠Breaking distance could be used as a parameter to qualify bonding pad robustness.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Dong Kil Shin, Jay Im,