| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 8037177 | Thin Solid Films | 2013 | 8 Pages |
Abstract
⺠The influence of temperature on cracking and buckling of a Ti/polyimide (PI) system is reported. ⺠The interfacial adhesion is found to reduce by a factor 3 following heating to 350 °C. ⺠An interlayer was observed in unheated samples at the Ti/PI interface. ⺠Phase separation of the interlayer is a likely cause of adhesion reduction.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
A.A. Taylor, M.J. Cordill, L. Bowles, J. Schalko, G. Dehm,