Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
8044304 | Vacuum | 2018 | 17 Pages |
Abstract
We report on the formation of a single nano-void, precisely positioned in SiO2/Si, using He-ion beam technique. The in-plane position of the void can be achieved by the direct writing capability of the He-ion beam system. While the depth and size of void are able to be determined by the acceleration voltage and dosage of the He+-ions, respectively. The as-written sample shows an ellipsoidal shape amorphous region in Si. Thermal treatments aggregate He-vacancy complexes and He bubble defects to form a void in the central of the region. At the same time, recrystallization starts from the boundary between the amorphous and crystal Si. Through HAADF imaging, EDX scanning profile and SEM imaging, we show the existence of a nano-void at a predicted depth. For the sample annealed at 825â¯Â°C, we observed a single void formed by {111} facets.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Surfaces, Coatings and Films
Authors
Che-Wei Yang, Chieh Chou, Wei-Chieh Chen, Hao-Hsiung Lin,