Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
8045374 | Vacuum | 2013 | 6 Pages |
Abstract
⺠We simulate all sputtering processes. ⺠First we simulate plasma formation, next target erosion, and lastly film deposition. ⺠We apply the method to magnetron sputtering apparatuses. ⺠One is a large cylindrical apparatus with diameter 1200 mm. ⺠Another is a three-dimensional apparatus.
Related Topics
Physical Sciences and Engineering
Materials Science
Surfaces, Coatings and Films
Authors
Kenichi Nanbu, Tatsuro Ohshita,