| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 8045434 | Vacuum | 2013 | 4 Pages |
Abstract
⺠TaN-(Ag,Cu) nanocomposite films were prepared combining co-sputtering and RTA. ⺠Antibacterial efficiency against either E. coli or S. aureus can be much improved. ⺠The annealing temperature for TaN-(Cu,Ag) can be as low as 200 °C. ⺠The synergistic effect due to the co-existence of Ag and Cu is obvious. ⺠The emergence of Ag and Cu particles can help reducing friction and wear rate.
Related Topics
Physical Sciences and Engineering
Materials Science
Surfaces, Coatings and Films
Authors
J.H. Hsieh, T.H. Yeh, C. Li, C.H. Chiu, C.T. Huang,