| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 8045502 | Vacuum | 2013 | 5 Pages |
Abstract
⺠Ag-Ti alloy film shows agglomeration suppression effect by forming thin Ti oxide layer at the film surface by annealing. ⺠Ti/Ag/Ti film shows the same effect and lower electrical resistivity than the alloy film. ⺠Ti interface layer can enhance adhesion between the Si oxide substrate and Ag film. ⺠Ti is useful as well as Al to suppress agglomeration phenomenon of Ag thin film.
Related Topics
Physical Sciences and Engineering
Materials Science
Surfaces, Coatings and Films
Authors
M. Kawamura, Z. Zhang, R. Kiyono, Y. Abe,