Analysis of stress intensity factors for edge interfacial cracks in bonded dissimilar media with a functionally graded interlayer under antiplane deformation

•Mode III edge interfacial cracks in bonded media with a graded interlayer are considered.•A system of singular integral equations is derived and stress intensity factors are evaluated.•The shielding and anti-shielding behaviors between the two edge cracks are addressed.•The effect of interlayer thickness depends on the shear modulus ratio and the crack length ratio.•The effect of shear modulus ratio differs, also depending on the crack length ratio.

In this paper, the problem of bonded dissimilar, homogeneous media with a functionally graded interlayer weakened by two parallel, edge interfacial cracks is investigated under the state of antiplane deformation. The Fourier integral transform method is employed to reduce the crack problem to a system of singular integral equations with generalized Cauchy kernels, which is solved based on the expansion–collocation technique. In the numerical results, parametric studies are conducted such that the mode III stress intensity factors are evaluated, addressing the interaction between the two neighboring edge cracks strongly affected by geometric and material parameters of the bonded system.