Experimental investigation of interface curing stresses between PMMA and composite using digital speckle correlation method

This paper studies the interface curing stresses between polymethyl methacrylate (PMMA) and composite by means of digital speckle correlation method (DSCM). A new method by combining DSCM with the marker points is developed to measure the interface curing stresses, and the measurement principle is introduced. The interface curing stresses between PMMA and composite with different curing bonding conditions are measured and analyzed, this indicates that the residual stress for furnace heating and furnace cooling is the smallest. Finally, the measurement error is discussed by means of finite element method, the influences of glass microsphere between adhesive and PMMA can be ignored.