Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
8148365 | Journal of Crystal Growth | 2018 | 12 Pages |
Abstract
In this work, we evaluate the effect of the novel symmetric multicycle rapid thermal annealing (SMRTA) process on both Mg ion implanted and non-implanted thick unintentionally doped GaN drift layers for vertical power devices. The typical p-type behavior and restoration of implant damage are observed in implanted samples, but on non-implanted samples a reduction in background carrier concentration and associated reduction in leakage current and increase in breakdown voltage is observed. This indicates that the capping/annealing process itself is not detrimental to the crystal, and the annihilation of native point defects in the process has beneficial effects for device structures.
Related Topics
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Condensed Matter Physics
Authors
T.J. Anderson, J.C. Gallagher, L.E. Luna, A.D. Koehler, A.G. Jacobs, J. Xie, E. Beam, K.D. Hobart, B.N. Feigelson,