Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
8161600 | Physica B: Condensed Matter | 2018 | 26 Pages |
Abstract
Limited by the low thermal resistance of composite material, ultra-low temperature curable conductive silver adhesive with curing temperature less than 100 °C needed urgently for the surface conduction treatment of piezoelectric composite material. An ultra-low temperature curable nano-silver conductive adhesive with high adhesion strength for the applications of piezoelectric composite material was investigated. The crystal structure of cured adhesive, SEM/EDS analysis, thermal analysis, adhesive properties and conductive properties of different content of nano-silver filler or micron-silver doping samples were studied. The results show that with 60 wt.% nano-silver filler the ultra-low temperature curable conductive silver adhesive had the relatively good conductivity as volume resistivity of 2.37 Ã 10â4 Ω cm, and good adhesion strength of 5.13 MPa. Minor micron-doping (below 15 wt.%) could improve conductivity, but would decrease other properties. The ultra-low temperature curable nano-silver conductive adhesive could successfully applied to piezoelectric composite material.
Keywords
Related Topics
Physical Sciences and Engineering
Physics and Astronomy
Condensed Matter Physics
Authors
Chao Yan, Qingwei Liao, Xingli Zhou, Likun Wang, Chao Zhong, Di Zhang,