Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
8163839 | Physica C: Superconductivity and its Applications | 2018 | 8 Pages |
Abstract
A new kind of Impregnation method using conductive material, solder, was proposed recently. Experimental results showed that the solder impregnation (SIM) method was a feasible method for fixing no-insulation (NI) coils. However, the charge delay of the solder impregnated coil is too long which is one of the shortcomings of this method. Therefore, this paper focuses on using the proportional and integral (PI) feedback control of the power supply to reduce the charge time of the SIM coil. Comparing the charge delay of the SIM coil without and with the PI control, the time to reach the target magnetic could be reduced from about 350â¯s to about 20 s and the relative overshoot could be limited within 4%. The test results show that the charge delay of the SIM coil can be well addressed. Moreover, for comparison, an insulation coil and a NI coil were both fabricated and tested.
Keywords
Related Topics
Physical Sciences and Engineering
Physics and Astronomy
Condensed Matter Physics
Authors
Y.Q. Li, Meiying Yin, J.W. Zhang, Z.Y. Li, Z. Hong, Z. Jin,