Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
8168818 | Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment | 2016 | 8 Pages |
Abstract
A silicon vertex detector (SVD) for the Belle-II experiment comprises four layers of double-sided silicon strip detectors (DSSDs), assembled in a ladder-like structure. Each ladder module of the outermost SVD layer has four rectangular and one trapezoidal DSSDs supported by two carbon-fiber ribs. In order to achieve a good signal-to-noise ratio and minimize material budget, a novel chip-on-sensor “Origami” method has been employed for the three rectangular sensors that are sandwiched between the backward rectangular and forward (slanted) trapezoidal sensors. This paper describes the bonding procedures developed for making electrical connections between sensors and signal fan-out flex circuits (i.e., pitch adapters), and between pitch adapters and readout chips as well as the results in terms of the achieved bonding quality and pull force.
Keywords
Related Topics
Physical Sciences and Engineering
Physics and Astronomy
Instrumentation
Authors
K.H. Kang, H.B. Jeon, H. Park, S. Uozumi, K. Adamczyk, H. Aihara, C. Angelini, T. Aziz, V. Babu, S. Bacher, S. Bahinipati, E. Barberio, T. Baroncelli, A.K. Basith, G. Batignani, A. Bauer, P.K. Behera, T. Bergauer, T. Yoshinobu,