Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
8175503 | Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment | 2014 | 5 Pages |
Abstract
Various structures for n-in-p planar pixel sensors have been developed at KEK in order to cope with the huge particle fluence in the upcoming LHC upgrades. Performances of the sensors with different structures have been evaluated with testbeam. The n-in-p devices were connected by bump-bonding to the ATLAS Pixel front-end chip (FE-I4A) and characterized before and after the irradiation to 1Ã1016 1Â MeV neq/cm2. Results of measurements with 120Â GeV/c momentum pion beam at the CERN Super Proton Synchrotron (SPS) in September 2012 are presented.
Related Topics
Physical Sciences and Engineering
Physics and Astronomy
Instrumentation
Authors
K. Motohashi, T. Kubota, K. Nakamura, R. Hori, C. Gallrapp, Y. Unno, O. Jinnouchi, S. Altenheiner, Y. Arai, M. Hagihara, M. Backhaus, M. Bomben, D. Forshaw, M. George, K. Hanagaki, K. Hara, M. Hirose, Y. Ikegami, K. Yorita,