Embedded pitch adapters for the ATLAS Tracker Upgrade

In the current ATLAS tracker modules, sensor bonding pads are placed on their corresponding strips and oriented along the strips. This creates a difference in pitch and orientation between sensor bond pads and readout electronics bond pads. Therefore, a pitch adapter (PA), or “fan-in”, is needed. The purpose of these PA is the electrical interconnection of every channel from the detector bonding pads to the read-out chips, adapting the different pad pitch. Our new approach is to build those PAs inside the sensor; this is what we call Embedded Pitch Adapters. The idea is to use an additional metal layer in order to define a new group of pads, connected to the strips via tracks with the second metal. The embedded PAs have been fabricated on 4-in. prototype sensors for the ATLAS-Upgrade Endcap Tracker to test their performance and suitability. The tests confirm proper fabrication of the second metal tracks, and no effects on detector performance. No indication of cross-talk between first and second metal channels has been observed. A small indication of possible signal pick-up from the bulk has been observed in a few channels, which needs to be further investigated.