Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
818281 | Composites Part B: Engineering | 2013 | 6 Pages |
Abstract
A numerical model for simulating the flow of an adhesive during an insertion squeeze flow (ISF) bonding process for joining composite structures is presented. The model is developed using the commercial CFD code FLUENT®. The numerical model is validated for a Newtonian fluid by comparing the predicted insertion forces that act during the insertion process with those obtained both from experiments and calculated using a simplified analytical model. Very good agreement is obtained. The model is then used to investigate the effect of insertion speed and adhesive viscosity on the ISF bonding process. The findings, and the further application of the numerical and analytical models, are valuable to ensure the quality of Pi-slot joints.
Related Topics
Physical Sciences and Engineering
Engineering
Engineering (General)
Authors
P. Burka, X. Liu, M.C. Thompson, J. Sheridan,