An investigation of the effect of SiC particle size on Cu–SiC composites

In this study mechanical properties of copper were enhanced by adding 1 wt.%, 2 wt.%, 3 wt.% and 5 wt.% SiC particles into the matrix. SiC particles of having 1 μm, 5 μm and 30 μm sizes were used as reinforcement. Composite samples were produced by powder metallurgy method and sintering was performed in an open atmospheric furnace at 700 °C for 2 h. Optical and SEM studies showed that the distribution of the reinforced particle was uniform. XRD analysis indicated that the dominant components in the sintered composites were Cu and SiC. Relative density and electrical conductivity of the composites decreased with increasing the amount of SiC and increased with increasing SiC particle size. Hardness of the composites increased with both amount and the particle size of SiC particles. A maximum relative density of 98% and electrical conductivity of 96% IACS were obtained for Cu–1 wt.% SiC with 30 μm particle size.