| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 822437 | Composites Science and Technology | 2007 | 8 Pages |
The study aims at investigating package materials based on combinations of nanometallic particles and polymers for microelectronics. Understanding the behaviors of this combination materials and being able to tailor them to give a desired composite properties are of great importance. In this present study, silver nanoparticles (Ag) were used as metallic conductive filler and it was applied in epoxy resin to produce silver nanoparticles filled epoxy composites. The electrical and flexural properties of silver nanoparticles-filled epoxy composites, as functions of filler loading (0–8 vol.%) were investigated. Furthermore, study on the effect of silane coupling agent treatment on the electrical and flexural properties of Ag nanoparticles-filled epoxy composites was carried out. The electrical property characterization indicates that the insulator-to-conductor transition occurred at percolation threshold of 5 vol.% of Ag. Treatment of Ag by silane-based coupling agent exhibited remarkable improvement in electrical and flexural properties of the composite system. Morphological studies have shown noticeable improvement in filler dispersivity in the treated composite system compared to those untreated system. FTIR analysis indicates the existence of –Si–O–C–, C–N and Si–H silane bonding in the treated composites, which subsequently improve the adhesion and enhance the electrical and flexural properties of the treated composite system.
