Structural characterization and creep resistance of nano-silicon carbide reinforced Sn–1.0Ag–0.5Cu lead-free solder alloy

•SiC nanoparticles have been reinforced into Sn–1.0Ag–0.5Cu solder.•SiC nanoparticles can effectively reduce the undercooling and pasty range.•0.35% SiC increased the creep resistance and fracture lifetime of the solder.•This effectiveness is reduced when 0.75% SiC was added.

Nano-sized, non-reacting, non-coarsening SiC particles were successfully fabricated by high energy ball milling. Mechanically mixing was adopted to prepare SiC-particulate reinforced Sn–1.0Ag–0.5Cu (SAC105) composite solders. The effects of SiC addition on the melting behavior, microstructure and the corresponding creep properties were explored. It is found that the addition of 0.35–0.75 wt.% SiC nano-sized particles can effectively decrease the undercooling, while the melting temperature is sustained at the SAC(105) level, indicating that the novel composite solder is fit for existing soldering process. After the addition of 0.35% SiC nano-particles, a fine microstructure of Ag3Sn and Cu6Sn5 IMCs with small spacing appeared in the β-Sn matrix. Moreover, the creep rate of the composite solder exhibited a consistently lower value than that of plain SAC(105) solder due to a second phase dispersion strengthening mechanism as well as a refinement of IMCs. Hence, the composite SAC(105)/0.35% SiC solder displayed a higher creep resistance (3.1 times) and fracture lifetime (3 times) than that of plain solder. However, this effectiveness is reduced when 0.75% SiC addition starts constricting the growth Ag3Sn and Cu6Sn5 IMC and forming a weak interface with the enlarged β-Sn matrix.