On the thermal conductivity of Cu–Zr/diamond composites

Interfaces and close proximity between the diamond and the metal matrix are very important for their thermal conductance performance. Matrix-alloying is a useful approach to greatly enhance the interfacial bonding and thermal conductivity. In this study, the copper–diamond (Cu/Dia) composites with addition of 0.8, 1.2 and 2.4 wt.% zirconium (Zr) are prepared to investigate the influence of minor addition of Zr on the microstructure and thermal conductivity of the composites. The thermal conductivity of the composites is analyzed both experimentally and theoretically. It is demonstrated that moderate interfacial modification due to the Zr added is beneficial to improve the thermal conductivity of the Cu/Dia composites.

► We study the microstructure and thermal conductivity of Cu–Zr/diamond composites. ► The addition of Zr greatly improves the interfacial bonding of Cu/diamond composites. ► The addition of Zr greatly enhances the thermal conductivity of Cu/diamond composites. ► The modified H–J model combined with DMM model agree well with the experimental data.