| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 830709 | Materials & Design (1980-2015) | 2012 | 7 Pages |
Transient Liquid Phase (TLP) bonding of two dissimilar alloys Al7075 and Ti–6Al–4V has been done at 500 °C under 5 × 10−4 torr. Cu was electrodeposited on Al7075 and Ti–6Al–4V surfaces, 50 μm thick Sn–4Ag–3.5Bi film was used as interlayer and bonding process was carried out at several bonding times. The microstructure of the diffusion bonded joints was evaluated by Light Optical Microscopy (LOM), Scanning Electron Microscopy (SEM) and Energy Dispersive Spectroscopy (EDS). The eutectic and intermetallic compounds formation along Al7075 grain boundaries and Ti/Al interface such as θ(Al2Cu), TiAl and Ti3Al were responsible for joint formation at the aluminum and titanium interfaces. Microhardness and shear strength tests were used to investigate the mechanical properties of the bonds. Hardness of the joints increased with increasing bonding time which can be attributed to the intermetallics formation at the interface. The study showed that the highest bond strength was 36 MPa which was obtained for the samples joined for 60 min.
► Joining of Al7075 to Ti–Al–4V is favorable for aerospace industry. ► Two main challenges presents in Al alloys to Ti alloys joining. ► Transient Liquid Phase (TLP) is a preferred joining process for joining dissimilar metals. ► A novel alloy was used as an interlayer.
