Article ID Journal Published Year Pages File Type
830764 Materials & Design (1980-2015) 2012 7 Pages PDF
Abstract

This paper deals with preparation of nanocomposites using modified nanoclay (organoclay) and polypropylene (PP), with, and without compatibilizer (m-TMI-g-PP) to study the effects of modified nanoclay and compatibilizer on viscoelastic properties. Nanocomposites were prepared in two steps; compounding of master batch of nanoclay, polypropylene and m-TMI-g-PP in a torque rheometer and blending of this master-batch with polypropylene in a twin-screw extruder in the specific proportions to yield 3–9% nanoclay by weight in the composite. Dynamic Mechanical Analysis (DMA) tests were carried out to investigate the viscoelastic behavior of virgin polypropylene and nanocomposites. The dynamic mechanical properties such as storage modulus (E′  ), loss modulus (E″E″) and damping coefficient (tan δ) of PP and nano-composites were investigated with and without compatibilizer in the temperature range of −40 °C to 140 °C at a step of 5 °C and frequency range of 5 Hz to 100 Hz at a step of 10 Hz. Storage modulus and loss modulus of the nano-composites was significantly higher than virgin polypropylene throughout the temperature range. Storage modulus of the composites increased continuously with increasing nano-content from 3% to 9%. Composites prepared with compatibilizer exhibited inferior storage modulus than the composites without compatibilizer. Surface morphology such as dispersion of nanoclay in the composites with and without compatibilizer was analyzed through Atomic Force Microscope (AFM) that explained the differences in viscoelastic behavior of composites.

► Synthesis of nanocomposites were carried out using master batch route. ► Properties of nanocomposites were obtained with and without compatabilizers. ► Better viscoelastic properties resulted with nanoclay addition. ► Use of compatibilizer resulted in degradation of properties of nanocomposites. ► AFM confirmed the experimental results.

Related Topics
Physical Sciences and Engineering Engineering Engineering (General)
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