| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 830772 | Materials & Design (1980-2015) | 2012 | 13 Pages |
In the present study, Ti–6Al–4V alloy was bonded to electrolytic copper at various temperatures of 875, 890 and 900 °C and times of 15, 30 and 60 min through diffusion bonding. 3 MPa uniaxial load was applied during the diffusion bonding. Interface quality of the joints was assessed by microhardness and shear testing. Also, the bonding interfaces were analysed by means of optical microscopy, scanning electron microscopy and energy dispersive spectrometer. The bonding of Ti–6Al–4V to Cu was successfully achieved by diffusion bonding method. The maximum shear strength was found to be 2171 N for the specimen bonded at 890 °C for 60 min. The maximum hardness values were obtained from the area next to the interface in titanium side of the joint. The hardness values were found to decrease with increasing distance from the interface in titanium side while it remained constant in copper side. It was seen that the diffusion transition zone near the interface consists of various phases of βCu4Ti, Cu2Ti, Cu3Ti2, Cu4Ti3 and CuTi.
► Electrolytic copper and Ti–6Al–4V were bonded successfully diffusion bonding. ► The effects of bonding temperature and holding time on joint properties were investigated. ► Microstructural aspects with mechanical properties of the interface were co-related. ► Several CuTi intermetallic compounds were formed in the interface region.
