Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
830830 | Materials & Design (1980-2015) | 2012 | 5 Pages |
A novel reactive technique has been employed in fabrication of 2.0 wt.%TiB2/70Si–Al composite for electronic packaging applications. The microstructure and properties of composite were studied using scanning electron microscopy, energy dispersive X-ray spectrometer, coefficient of thermal expansion and thermal conductivity measurements, and 3-point bending tests. The results indicate that the in situ TiB2 particles can effectively refine the primary Si phase. The property measurements results indicate that the 2.0 wt.%TiB2/70Si–Al composite has advantageous physical and mechanical properties, including low density, low coefficient of thermal expansion, high thermal conductivity, high Flexural strength and Brinell hardness.
► 2.0 wt.%TiB2/70Si–Al composite is prepared by a novel reactive technique. ► In situ TiB2 particles can refine effectively the primary Si phase. ► The composite exhibited attractive physical and mechanical properties.