| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 831522 | Materials & Design (1980-2015) | 2011 | 9 Pages |
As-cast Al/Mg2Si metal matrix composite was joined by transient liquid phase diffusion bonding using Cu interlayer at various bonding temperatures and durations. This metal matrix composite contained 15% Mg2Si and was produced through in situ technique by gravity casting. Specific diffusion bonding process was applied as a low vacuum technique. The microstructure of joints consisted of Al-α, CuAl2 and Mg2Si or Al-α and Mg2Si depending on bonding temperature and duration. The maximum shear strength was achieved when samples were bonded at 580 °C for 120 min. Micro-hardness and compositional homogeneity of joints across the bonded interface were improved with increasing the bonding duration at 560 °C and had no significant changes at 580 °C.
Research highlights► Evaluation of TLP feasibility for joining of Al/Mg2Si MMC using Cu interlayer. ► Evaluation of bonding temperature and duration effects. ► Evaluation of TLP process under low vacuum. ► Evaluation of TLP diffusion bonding in cast MMCs with porosity.
