Design of laser micromachined single crystal 6H–SiC diaphragms for high-temperature micro-electro-mechanical-system pressure sensors

A 248-nm, 23-ns pulsed excimer laser was used to micromachine 50 μm thick diaphragms in 6H–SiC wafers. The diaphragms were then subjected to high-pressure (0.7–7 MPa) and high temperature (500 K) tests to obtain the pressure-deflection curves. A finite element model was used to predict the stresses and displacements as a function of temperature and pressure. Model data is in good agreement with experiments. The stresses, strains and displacements were determined in order to facilitate the design of high-temperature micro-electro-mechanical-system pressure sensors.