Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
832837 | Materials & Design (1980-2015) | 2009 | 7 Pages |
Abstract
The uniaxial tensile inelastic deformation behavior for three types of lead-free solders, Sn–3Ag–0.5Cu, Sn–3.5Ag and Sn–0.7Cu, were simulated by a unified viscoplastic constitutive model, the Anand model. To obtain the material parameters for the Anand model, a series of constant true strain rate and temperature tests were conducted on three types of lead-free solders at various strain rates from 1 × 10−4 s−1 to 1 × 10−2 s−1, over a wide temperature range from 25 °C to 150 °C. A modified Anand model, in which h0 was set to a function of strain rate, was proposed. The comparison of the experimental and simulated results showed that the modified Anand model improved the simulation capability.
Related Topics
Physical Sciences and Engineering
Engineering
Engineering (General)
Authors
Ning Bai, Xu Chen, Hong Gao,