| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 852159 | Optik - International Journal for Light and Electron Optics | 2010 | 4 Pages |
Abstract
We exploited the coupling efficiency between a rear-facet emission of a light emitting device and a monitoring photo detector (mPD) in a transistor-outlined (TO) package. By considering the far-field angles of the back illuminating light and the detector area, we could achieve two-dimensional tolerance of the coupling efficiency in the compact microelectronic package under mechanical limitation.
Keywords
Related Topics
Physical Sciences and Engineering
Engineering
Engineering (General)
Authors
Jae-Ho Han, Zail Lhee,