| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 852984 | Procedia Engineering | 2016 | 4 Pages |
Abstract
The quality of end production units of either packing or microelectronic industry depends on characteristics of a ground (ink) layer covering a polymer substrate. The complex procedure of automatic quality control of the ground coating in a “ground -substrate” system is offered. The algorithm for estimation of the ground layer quality control includes three stages: microgeometry parameters of substrate surface definition, analyzing of ground distribution on / in volume of substrate surface (coverage), adhesion strength for a “ground – substrate” system. For qualitative and quantitative estimation of ground coating parameters such criterions as a substrate roughness, layer or substrate coverage rate, and adhesion strength were used.
Related Topics
Physical Sciences and Engineering
Engineering
Engineering (General)
Authors
L.G. Varepo, O.V. Trapeznikova, E.V. Trapeznikov, I.V. Nagornova,