Effect of Bond Type and Process Parameters on Grinding Force Components in Grinding of Cemented Carbide

This paper presents selected results of research in the field of grinding cemented carbide with the use of diamond grinding wheels. In the fundamental experiments two different types of diamond grinding wheels were used. The diamond grinding wheels were varied by bonding material. In the investigation, response surface method was used to predict grinding force components during grinding of the ductile cemented carbide CTS20D workpiece material. The grinding speed, depth of cut and feed rate were considered as input process parameters. Furthermore, the ANOVA (analysis of variance) was employed for checking the developed model results. The results revealed that grinding with the use of resin bond grinding wheel provides significantly lower grinding force components during the process. Moreover, the significance of models terms was determined. It was shown that for the adapted range of process parameters, grinding speed has significant effects only on tangential force for resign bond diamond grinding wheel.