| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 855917 | Procedia Engineering | 2015 | 5 Pages |
Abstract
To decrease the cleanroom requirement of a MEMS chip fabrication, Nd:YAG laser machining is integrated into silicon micromachining. However, to get a smooth surface the laser parameters must be chosen carefully, and a subsequent wet chemical etching treatment of the surface is essential.The process is used to fabricate a Thermoelectric Nanowire Characterization Platform (TNCP). Our TNCPs are designed to measure a single nanowire's thermoelectric properties: heat and electrical conduction, and the Seebeeck coefficient. Furthermore it has the unique ability to also study the crystallographic structure of these nanowires by transmission electron microscopy (TEM).
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