Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
858233 | Procedia Engineering | 2014 | 5 Pages |
The touch panel technology has been developed in recent years, and the foldable touch panel is one of the newly attractive characteristics. This article focuses on the bending stress analysis of foldable touch panel, composed of plastic substrate PET, adhesive layer, plastic layer PI, organic layer and conductive layer ITO to form a seven-layer laminated structure. By applying four-point bending, the stress distribution of the touch panel under different radius of curvature was analyzed. The results show that the maximum von Mises stress occurred in the ITO layer and the maximum von Mises stress increased from 0.497 GPa to 1.242 GPa with decreasing radius of curvature. The region near the center of the touch panel has higher von Mises stress, and the relation between the radius of curvature and the maximum von Mises stress exhibits a non-linear feature.