Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
862189 | Procedia Engineering | 2012 | 6 Pages |
Abstract
Encapsulation materials are very vital to the power light emitting diode packaging and become a hot topic for worldwide researchers because the devices packaging and assembly yield, and the devices reliability and lifespan are determined by the quality of packaging and assembly materials as well as their processing. In this paper, the functions requirements and properties of power LED packaging materials were introduced. In addition, the research progress on traditional LED packaging materials, especially high refractive index silicone encapsulants were discussed in detail. Meanwhile, the direction of further development of encapsulation materials was pointed out.
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