Fabrication of Insulating Micropatterns for Inner Electrode of Multilayer Ceramic Capacitor by Electrophoretic Deposition Based on SiO2 Nanopowder

Micropatterns of silica were fabricated on interdigitated array (IDA) electrode used to be the insulting layer of inner electrode of multilayer ceramic capacitor (MLCC) by electrophoretic deposition. A three-electrode circuit system was applied to deposit the silica nanoparticle on the silver IDA electrode. The three-electrode system shows better deposition selectively of interval. Smaller IDA electrode spacing performed faster deposition rate and lower applied voltage. A crack-free film of silica was deposited at 10 V applied voltage for 20 s and sintered at 800oC. The resistance of micropattern film is 7 x 109 ohm. The adhesion between silica layer and electrode was improved after sintering.