| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 863867 | Procedia Engineering | 2011 | 5 Pages |
Abstract
It is a main techniques that Time Multiplexed Deep Etching(TMDE) in Inductive Couple Plasmas (ICP), we designed a simulation program of TMDE based on the modeling research and experiments, solved distinguish different etching material and etching geometry based on traditional line algorithm, optimized etching way efficiently,
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