Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
8869372 | Waste Management | 2018 | 7 Pages |
Abstract
In this study, using several types of acidic ionic liquids as the leaching reagents, the leaching behaviors of the copper present in waste printed circuit boards (WPCBs) were investigated. The effects of various parameters on the copper leaching rate were studied, such as the particle size of the shredded WPCB, type of ionic liquid used, hydrogen peroxide dosage, solid-to-liquid ratio, leaching temperature, and leaching time. The experimental results showed that the copper leaching rate increases continuously when the powder particle size is increased from 0.071 to 0.500â¯mm. Moreover, the copper leaching rate also increases with an increase in the leaching temperature. In contrast, the leaching rate first increases and then decreases with increases in the leaching time, hydrogen peroxide dosage, and solid-to-liquid ratio. The optimal conditions that provided a 98.31% copper leaching rate were: particle size >0.500â¯mm, 8.5â¯mL 90% (v/v) ionic liquid, 1.5â¯mL 30% hydrogen peroxide, solid-to-liquid ratio of 1/20, leaching temperature of 80â¯Â°C, and leaching time of 2â¯h.
Related Topics
Physical Sciences and Engineering
Earth and Planetary Sciences
Geotechnical Engineering and Engineering Geology
Authors
Ding-jun Zhang, Li Dong, Yong-tong Li, Yanfei Wu, Ying-xia Ma, Bin Yang,