Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
8910449 | Chemical Geology | 2018 | 77 Pages |
Abstract
Acetate ions are widely distributed in various geo-fluids and can be enriched in metamorphic brines under saturated vapor pressure in the temperature range of 80 to 200 °C. To examine the potential role of acetate in transporting metals, we conducted a series of ab initio molecular dynamics (MD) simulations to investigate the complexation of Cu+ with Clâ, HSâ and acetate ions. All the ab initio MD simulations were conducted at the temperature of 150 °C and pressures of 10 bar or 1000 bar. The ionic compositions of aqueous solutions for the simulations include four groups: (1) Cu+ and CH3COOâ; (2) Cu+, CH3COOâ and Clâ; (3) Cu+, CH3COOâ, Clâ and HSâ; and (4) Cu+, CH3COOâ and HSâ. The simulation results demonstrated some important regularities for complexation of copper with acetate. The static computation results suggest that Cu+ forms linear complexes with one or two acetate ions, rather than with one acetate ion in a nearly symmetric bidentate structure. The stoichiometry of the complexes, which can be represented by [Cu(CH3COO)(H2O)], [(CH3COO)2Cu]â and [Cu(CH3COO)Cl]â, depends on the fluid composition, environmental pressure and solvated structures of the acetate ligands in these complexes. Compared with Clâ, the acetate ion is a ligand of higher affinity for Cu+, and the solvated structure of acetate ligands can prevent Clâ from approaching Cu+. The presence of HSâ also inhibits the formation of a Cu-Cl bond, thereby enhancing the stability of the Cu-OH2 bond in [Cu(CH3COO)(H2O)]. We also investigated the free energy surfaces of the ligand exchange reactions, CuCH3COO2-+2Cl-=CuCl2-+2CH3COO-andCuCH3COO2-+2HS-=CuHS2-+2CH3COO-. Combined with the results from ab initio MD simulations, we conclude that the order of affinity of Cu+ to form complexes in these conditions is HSâ > CH3COOâ > Clâ > H2O. These conclusions provide important evidence for evaluating the role of acetate ligands in transporting Cu during low temperature mineralization.
Related Topics
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Authors
Feng Lai, Liangming Liu, Wei Cao,