Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
8918879 | Thermal Science and Engineering Progress | 2017 | 19 Pages |
Abstract
The ability to measure intrinsic thermal conductivity via a non-contact, non-destructive process is extremely attractive. Micro-Raman spectroscopy has been demonstrated to enable effective non-contact thermometry with further work providing a non-destructive estimation of values for thermal conductivity on suitable materials. However significant limitations remain for nano- and micro-films. Materials that do not meet dimensional requirements for thickness or that are in-situ on a substrate or supporting structure present significant challenges using existing approaches. For such samples, representative measurements must be obtained using alternative methods that can compromise samples and/or require relative complexity in experimental design and analysis. Here an analytical model is shown allowing thermal conductivity to be measured free of such limitations via a straightforward approach using micro-Raman spectroscopy. Results are then obtained experimentally and values compared with those obtained using a complimentary technique demonstrating an improved accuracy over existing micro-Raman approaches. Furthermore, this model enables the effect of any substrate or supporting structure on measured values to be quantified and estimations for thermal conductivity of the sample itself to then be calculated where an influence is determined. Current estimations determining the threshold of substrate influence are shown to be insufficient and the importance of obtaining values of thermal conductivity for samples themselves under such conditions is demonstrated.
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Authors
N.M. Wight, E. Acosta, R.K. Vijayaraghavan, P.J. McNally, V. Smirnov, N.S. Bennett,