| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 9567617 | Applied Surface Science | 2005 | 4 Pages |
Abstract
Patterned gold microstructures on glass or Si wafers have been fabricated by a novel method which is composed of selective electroless plating and microcontact printing. This process may be widely used for the production of fine metal patterns in printed circuits or as a substrate to form patterned SAMs. In addition, these patterned metal microstructures can be readily transferred to adhesive tape surface to fabricate flexible metal microstructure, which may be applied in all-plastic circuit.
Related Topics
Physical Sciences and Engineering
Chemistry
Physical and Theoretical Chemistry
Authors
Fei Guan, Miao Chen, Wu Yang, Jinqing Wang, Shengrong Yong, Qunji Xue,