| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 9674296 | Journal of Hazardous Materials | 2005 | 6 Pages |
Abstract
The effect of surfactants on the treatment of chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation (ECF) process was studied. Two surfactants, cetyltrimethylammonium bromide (CTAB) and sodium dodecylsulfate (SDS) were employed in this study to compare the effect of cationic (CTAB) and anodic (SDS) surfactants on ECF. The cationic surfactant can enhance the removal of the turbidity, but anodic surfactant cannot. It can be explained by the hetero-coagulation theory. Moreover, the addition of CTAB in CMP wastewater can reduce the sludge volume and the flotation/sedimentation time in ECF process. The residual turbidity and dissolved silicon dropped with the increase of charge loading. No CTAB pollution problem exists after the ECF process.
Keywords
Related Topics
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Chemical Engineering
Chemical Health and Safety
Authors
C.Y. Hu, S.L. Lo, C.M. Li, W.H. Kuan,