Article ID Journal Published Year Pages File Type
9679461 Wear 2005 7 Pages PDF
Abstract
Models of the wear mechanism are proposed. For no pin lifting, the pin undergoes adhesive wear due to the breakdown of coarse films. For the pin lifting height (h) lower than 5 μm, since the load is partly supported by a small amount of wear particles on thin films, abrasive wear occurs due to hard oxide particles. For h > 5 μm, many wear particles support the load on the compacted films, and thus, the pin surface is in rolling or sliding contact with the wear particles resulting in a decrease in wear rate.
Related Topics
Physical Sciences and Engineering Chemical Engineering Colloid and Surface Chemistry
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