| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 9693900 | Thermochimica Acta | 2005 | 8 Pages |
Abstract
Thermal analytical study of two types of polyurethane-based polishing pads for chemical mechanical planarization (CMP) was conducted using DMA, TMDSC, TMA, and TGA. The pads were subjected to thermal treatments at various temperatures for different time. Based on the results of thermal analysis, recommendations to optimize pad properties were made.
Related Topics
Physical Sciences and Engineering
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Authors
A. Tregub, G. Ng, J. Sorooshian, M. Moinpour,