Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9699691 | Sensors and Actuators A: Physical | 2005 | 7 Pages |
Abstract
Design and construction of GaAs-based micromachined thermal converter device consisting of a high electron mobility transistor (as a microwave heater) and a thin film resistor (as a temperature sensor), integrated on 1 μm thick polyimide fixed GaAs/AlGaAs island structure are introduced. The influence of thermal residual stresses as well as device temperature variations on membrane-like multilayer structure are discussed. A noninvasive and contactless optical methods such as laser confocal microscopy, laser Doppler vibrometry (LDV) and thin layer interferometry are applied to analyze experimentally the thermo-mechanical properties of the micromachined device. LDV method is used to evaluate the device temperature time constant (Ïc â¼1.5 ms) and nano-deformations induced by the temperature changes at any point of device. A confocal microscope is chosen to analyse the 3D deformation profiles of the device at different temperature-induced stress states. The device deformation changes (â¼3 μm) induced by power dissipation of 9.5 mW (temperature increase of 395 K) are found to be negligible with respect to the dimensions of the polyimide fixed island structure (160 μm Ã 120 μm).The optical characterization methods are proved to be a useful tool in design of new thermally based MEMS devices.
Keywords
Related Topics
Physical Sciences and Engineering
Chemistry
Electrochemistry
Authors
T. Lalinský, M. DržÃk, J. ChlpÃk, M. KrnáÄ, Å . HaÅ¡ÄÃk, Ž. Mozolová, I. KostiÄ,