Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9703898 | International Journal of Fatigue | 2005 | 7 Pages |
Abstract
Microstructural characterisation using image analysis approaches combined with optical profilometry has been used to assess the fracture surfaces of test samples. The role of primary Si in enhancing crack growth rates at high ÎK levels, whilst affording improvements in crack growth rates at lower ÎK levels due to local crack deflections and shielding, has been confirmed. In the absence of primary Si (lower Si content alloys) the low ÎK level crack growth behaviour is dominated by matrix properties (intra-dendritic crack growth pre-dominates) whilst the high ÎK level crack growth behaviour is inter-dendritic and occurs along the weak path of the eutectic Si and/or intermetallic network.
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Physical Sciences and Engineering
Engineering
Mechanical Engineering
Authors
A.J. Moffat, S. Barnes, B.G. Mellor, P.A.S. Reed,