Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9711219 | Journal of the Mechanics and Physics of Solids | 2005 | 20 Pages |
Abstract
Utilizing this technique, both yielding and strain hardening of Cu thin films on silicon substrates have been investigated. Copper films with dual crystallographic textures and different grain sizes, as well as others with strong ã1Â 1Â 1ã textures have been studied. Three strongly textured ã1Â 1Â 1ã films were studied to examine the effect of film thickness on the deformation properties of the film. These films show very high rates of work hardening, and an increase in the yield stress and work hardening rate with decreasing film thickness, consistent with current dislocation models.
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Authors
J.N. Florando, W.D. Nix,