Article ID Journal Published Year Pages File Type
9783890 Materials Science and Engineering: B 2005 8 Pages PDF
Abstract
Among the different substrate level options investigated by the industry, we will focus here on strained Si layers on insulator. Different wafer manufacturing techniques will be considered, and the potential of wafer bonding and layer transfer techniques will be highlighted.
Keywords
Related Topics
Physical Sciences and Engineering Materials Science Electronic, Optical and Magnetic Materials
Preview
Strain engineering in SOI-type materials for future technologies
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