Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9796088 | Materials Science and Engineering: A | 2005 | 5 Pages |
Abstract
The effects on dislocation glide of the substitutional element copper in solution in α-iron are being investigated by computer simulation. In the first phase, the critical stress for a 1/2 ã1 1 1ã {1 1 0} edge dislocation to overcome configurations of either a single or two nearest-neighbour solute atoms is simulated. Molecular statics and dynamics methods are used to simulate effects at temperature equal to and greater than 0 K, respectively. Single copper atoms and nearest-neighbour pairs in the first atomic plane below the glide plane give the strongest barrier to dislocation glide, in partial agreement with elasticity theory. In addition to temperature, obstacle-spacing effects are considered.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
K. Tapasa, D.J. Bacon, Yu.N. Osetsky,