Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9796121 | Materials Science and Engineering: A | 2005 | 4 Pages |
Abstract
An in-situ annealing experiment has been performed on an intergranular dislocation configuration composed only of glissile grain boundary dislocations observed in a near Σ = 3 {1 1 1} grain boundary in copper. Relaxation phenomena are not obvious than those predicted by theoretical models. Upon annealing, glissile intergranular dislocations are shown to overcome dislocation obstacles by node movement leading to a decrease of the total grain boundary energy.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
J.P. Couzinié, B. Décamps, L. Boulanger, L. Priester,