Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9796248 | Materials Science and Engineering: A | 2005 | 7 Pages |
Abstract
High-temperature Si implantation at 1173Â K shows better oxidation resistance than that implanted at room temperature (RT) for the long-term oxidation. The C introduction by CÂ +Â Si double implantation weakened the beneficial effect of Si, and the following annealing improved its oxidation resistance. Si doping in the TiAl alloy could facility the Al2O3 formation in the early stage of the oxidation through the enhancement of the Al activity, and C doping is harmful because of a porous oxide scale. From this study, it is indicated that high-temperature implantation at 1173Â K is effective to thicken the Si-modified layer and thus, a strong and long-term Si modification effect. No cooperation effect of C and Si can be observed for CÂ +Â Si double implantation to intensify the Si beneficial effect.
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Physical Sciences and Engineering
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Authors
X.Y. Li, S. Taniguchi,