Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9803339 | Journal of Alloys and Compounds | 2005 | 8 Pages |
Abstract
The growth and morphology of the intermetallic compounds formed at the solder joint between the Sn-9Zn-2.5Ag lead-free solder and the Cu substrate have been investigated in this study. The planar Cu6Sn5 formed after soldering transforms to a scalloped Cu5Zn8 after aging at 180 °C for 250 h. However, the Cu5Zn8 decomposes and the scalloped Cu6Sn5 reforms at the interface close to the solder alloy after aging for 400 h. The ηâ²-Cu6Sn5 transforms to the η-Cu6Sn5 as aged at 180 °C. The interdiffusion coefficient of Cu and Sn in the Cu6Sn5 is determined as 2.58 Ã 10â13 cm2 sâ1, and that of Cu and Zn in the Cu5Zn8 layers is determined as 3.36 Ã 10â14 cm2 sâ1 at 180 °C, from the estimated thickness of the intermetallic compound (IMC). On the other hand, they are determined as 3.43 Ã 10â13 and 2.36 Ã 10â14 cm2 sâ1, respectively, from the microbeam EDS analysis.
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Tao-Chih Chang, Moo-Chin Wang, Min-Hsiung Hon,