| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 9803932 | Journal of Alloys and Compounds | 2005 | 6 Pages |
Abstract
In the ball shear test, the shear strength value did not change much as a function of reflow time. In all samples, the fracture occurred in the bulk solder. The results of interfacial reaction and shear test in this study show that the Sn-Ag-Cu/Ni BGA solder joint has a desirable joint reliability.
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Jeong-Won Yoon, Sang-Won Kim, Seung-Boo Jung,